Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging - company establishing section as 'focused business with dedicated leadership'

Intel Hires Former SK hynix Chief Seok-Hee Lee to Lead Intel Foundry Advanced Packaging

Intel has appointed Seok-Hee Lee, the former chief executive of memory maker SK hynix and battery maker SK On, as executive vice president of Intel Foundry. The company is carving back-end packaging into a standalone business, handing the semiconductor veteran control of advanced packaging, system integration, and all back-end technology development and manufacturing.

Lee reports directly to CEO Lip-Bu Tan, and his arrival comes with a structural change at the foundry: Intel is splitting advanced packaging out as a dedicated business, with Naga Chandrasekaran narrowing his focus to front-end work on the Intel 18A and 14A nodes. Longtime executive Navid Shahriari is retiring after 37 years, the company announced.

Lee spent roughly a decade at Intel earlier in his career before holding leadership roles across the Korean chip industry, including the top job at SK hynix, one of the world's two largest suppliers of high-bandwidth memory. Tan credited Lee with "deep expertise in leading complex, high-scale technology and manufacturing organizations," and said the hire would help Intel "tightly couple leading-edge logic, memory, networking, and other components" for foundry customers.

Strategic Alignment with Memory and Packaging

Putting a former memory chief over packaging aligns with where Intel's back-end ambitions are. HBM stacks sit alongside logic dies inside the same package on every modern AI accelerator, and it's joining those two components together that Lee now oversees. Last month, it was reported that SK hynix was testing Intel's EMIB packaging for HBM integration, sending both companies' shares higher.

Tan named EMIB-T and HBI as the technologies Intel intends to ramp to high volume under Lee. EMIB-T adds through-silicon vias to Intel's embedded bridge for higher power delivery and HBM4-class bandwidth, and is rolling out in production fabs this year. Intel has positioned the EMIB family against TSMC's CoWoS, whose lines have been oversubscribed for more than two years, and is reportedly in talks with Google and Amazon to package their custom AI chips.

Financial Stakes and Industry Context

It goes without saying, then, that the stakes for the unit Lee's inheriting are huge. Intel Foundry lost $10.3 billion on $17.8 billion of revenue in 2025, and CFO David Zinsner has said packaging revenue could exceed $1 billion at gross margins near 40%, with prepaid hyperscaler commitments reaching into the billions.

Korean trade press, including the Seoul Economic Daily, has spun Lee's appointment around Intel's difficulty securing yields on its proprietary back-end processes, the kind of high-volume manufacturing problem he managed for decades in memory. The hire follows Intel's April recruitment of Samsung foundry veteran Shawn Han.

Lee resigned from SK On on May 28th, citing health reasons, according to Korean outlets, only to return to the industry three weeks later.